Atomic Layer Deposition
for Nano & Macro-Electronics
Cenamps has created a new facility for R&D on a thin film coating technology that makes it possible to control thickness at the sub-nanometre scale. The Atomic Layer Deposition (ALD) technique lays down a coating as a sequence of reproducible discrete layers each of which is approximately one atom thick. The composition of the coating is controlled by changing the chemicals that react to form each atomic layer.
ALD films have special properties that can be used to advantage in many different applications. These properties include:
- Uniform coating of complex 3-dimensional objects.
- Dense and highly-perfect films with low intrinsic stress.
- Good adhesion when mechanically stressed.
- Deposition at low (even ambient) temperatures.
- ‘Digital’ control of thickness by counting atomic layers deposited.
Examples of applications for ALD films include:
- Semiconductor microelectronic devices with better performance or lower power.
- Moisture and oxygen barrier layers on plastic film to increase the operating life of flexible plastic electronic devices.
- Very thin sealing layers on metal parts to prevent corrosion and release of metal ions.
ALD operations commenced during October 2007. Cenamps aims to become a leading centre for research and development of new applications for ALD and is actively seeking partners for collaborative R&D projects.
The ALD equipment handles substrates up to 200mm diameter and is fitted with robotic handling for processing of low volume batches. The tool is supplied by Oxford Instruments who will work closely with Cenamps to develop ALD coating processes that can be delivered to customers as a commercial service.
Initial funding has been provided by One NorthEast. The project aims to be financially self-sustaining by 2009 through revenues generated by its R&D and ALD service activities.